Aluminum Heat Sink 100x61x5.5mm

Extruded aluminum heat sink for passive dissipation of heat from power semiconductors and integrated circuits. It is suitable for mounting on a flat mating surface using thermal paste or thermally conductive adhesive according to application requirements.

Technical specifications

• Material: aluminum
• Dimensions: 100 × 61 × 5.5 mm
• Number of fins: 17
• Design: extruded profile
• Intended use: passive heat sink for electronic components

Functions and features

• Increased surface area due to finning for more efficient heat transfer to ambient air
• Suitable for cooling ICs, memories, chipsets and other components with planar contact
• Can be installed by adhesive (thermally conductive adhesive) or mechanically depending on device construction
• For proper operation it is recommended to use a thermally conductive material between the component and the heat sink

Ideal for

• Cooling integrated circuits and power elements in compact devices
• Electronic modules, power sections, control units and prototype constructions
• Repairs and modifications where improved heat dissipation from a chip or package is required

Package contents

• 1 pcs aluminum heat sink 100 × 61 × 5.5 mm

Why choose this product

• Standard aluminum heat sink with defined dimensions for easy integration into designs
• Finned profile for passive cooling without the need for a fan
• Suitable for a wide range of electronic applications requiring heat dissipation

Installation and operation instructions

• Before assembly, clean mating surfaces of dirt and grease
• To reduce thermal resistance use thermal paste or thermally conductive adhesive
• Verify mechanical compatibility with surrounding components and airflow in the device

Safety warnings

• During operation the heat sink may reach elevated temperatures; ensure protection against contact according to device design
• When using thermally conductive adhesives follow the manufacturer's instructions and provide adequate ventilation during application