Aluminum heatsink 100x41x8mm

Extruded aluminum heat sink for passive heat dissipation from power semiconductors and integrated circuits. It is suitable for mounting on a flat surface using thermal paste or thermal adhesive according to application requirements.

Technical specifications

• Material: aluminum
• Dimensions: 100 × 41 × 8 mm
• Number of ribs: 26
• Design: extruded profile
• Purpose: passive heat sink for electronic components

Functions and features

• Increased surface area due to fins for more efficient heat transfer to the surrounding air
• Suitable for cooling ICs, memories, chipsets and other surface-contact components
• Possibility of installation by gluing (thermally conductive adhesive) or mechanical attachment according to the device design
• For proper operation, it is recommended to use thermally conductive material between the component and the heat sink.

Ideal for

• Cooling of integrated circuits and power elements in compact devices
• Electronic modules, power supplies, control units and prototype designs
• Repairs and modifications to devices where heat dissipation from the chip or housing needs to be improved

Package contents

• 1 pc aluminum heatsink 100 × 41 × 8 mm

Why choose this product?

• Standard aluminum heat sink with defined dimensions for easy integration into the design
• Ribbed profile for passive cooling without the need for a fan
• Suitable for a wide range of electronic applications requiring heat dissipation

Installation and operating instructions

• Before assembly, clean the contact surfaces from dirt and grease.
• Use thermal paste or thermal adhesive to reduce thermal resistance
• Verify mechanical compatibility with surrounding components and airflow in the device

Safety notice

• The heat sink may be hot during operation; provide protection against contact according to the device design.
• When using thermally conductive adhesives, follow the manufacturer's instructions and ensure adequate ventilation during application.