Thermal paste GD-3, 3g, 7.5 W/m K

Thermally conductive paste GD-3 is designed to improve heat transfer between electronic components and heat sinks. It is used during assembly or servicing of processors, LED elements and other heat-stressed components, where it helps to fill microscopic irregularities between the contact surfaces.

Technical specifications

• Designation: GD-3
• Product type: thermal paste
• Packaging: syringe
• Color: gray
• Refill weight: 3 g
• Thermal conductivity: 7.5 W/m K
• Specific gravity: 2.5 g/cm3
• Operating temperature: -35 to +120 °C
• Intended use: for processors, LEDs and other components with heat dissipation requirements

Functions and features

• It serves as a thermally conductive interface between the component and the heat sink.
• The syringe design allows for more precise dosing during application.
• The gray paste is intended for application to the contact surfaces of cooled elements.
• Suitable for use in electronics and when mounting heat sinks on semiconductor elements.

Ideal for

• Processor installation and service.
• Applications with LED modules and LED coolers.
• Electronic components requiring heat transfer to a heat sink.
• Service and installation work in the field of electronics cooling.

Package contents

• 1x GD-3 thermal paste in a syringe, 3 g

Why choose this product?

• A clearly designated product for thermal connection between component and heat sink.
• Known thermal conductivity value given in the input documents.
• The syringe packaging facilitates controlled application.
• Suitable for service, maintenance and new installation of electronic devices.

Installation and operating instructions

• Clean and degrease both contact surfaces before application.
• Apply the paste in a thin, continuous layer only to the designated contact area.
• Excessive amounts may deteriorate the quality of the thermal bond and contaminate surrounding parts.
• After application, ensure proper pressure of the heat sink to the component.

Safety notice

• Use the product only to transfer heat between suitable contact surfaces.
• Avoid contact of the paste with connectors, contacts and other parts not intended for application.
• Do not apply to energized equipment.
• Keep out of reach of children.