Thermal paste GD770, 1kg

High-quality thermal paste for coolers with a thermal conductivity of up to 3.0W/mK. The thermal paste is designed to ensure better heat transfer between the heat source - the electronic component and its cooler. This fills the unevenness between the surface of the cooler and the surface of the cooled component and thus increases the transfer of heat to the cooler, which then has greater cooling efficiency. Thanks to the use of heat-conducting paste, you will make the cooling more efficient overall and extend the life of the cooled components. Suitable for all semiconductors (LEDs), processors, graphics cards, memory modules and more. The paste is not electrically conductive.

Thermal conductivity: 3.0W/mK

Minimum operating temperature: -50°C

Maximum operating temperature: 200°C

Specific gravity: > 3.0 g/Cc

Package weight: 1kg

The package also includes a plastic spatula for easier application.